Ultra-thin substrate
Introducing products suitable for those looking to produce a small quantity of ultra-thin rigid substrates!
We would like to introduce our "Ultra-thin Substrate" that we handle. Detailed designs tailored to customer requirements are possible through layer composition, copper foil thickness, and lamination methods. It has become an ultra-thin printed circuit board while maintaining the characteristics of rigid substrates. It can accommodate a wide range of methods, including build-up processes and through-hole technology, and unlike flexible substrates, it possesses both the electrical characteristics and strength of rigid substrates. 【Features】 ■ Innovative substrate materials and methods for 4-layer and 6-layer designs ■ Detailed designs tailored to customer requirements through layer composition, copper foil thickness, and lamination methods ■ Accommodates a wide range of methods, including build-up processes and through-hole technology ■ An ultra-thin printed circuit board that maintains the characteristics of rigid substrates ■ Unlike flexible substrates, it combines the electrical characteristics and strength of rigid substrates *For more details, please refer to the PDF document or feel free to contact us.
- 企業：モリマーエスエスピー 本社
- 価格：Other
